In case you missed us at APCSM 2022

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Effectiveness of Sampling Frequency Reduction in Wafer Manufacturing using     ML-based Virtual Metrology


Achieving a 5x reduction in physical measurements while maintaining high prediction quality in semiconductor manufacturing

In this presentation, Lynceus and NXP demonstrated how fabs can dramatically reduce physical measurements in semiconductor process manufacturing without a significant loss of prediction quality by applying hybrid modeling and advanced deep learning techniques.

Fill out the form to the right and you will immediately be able to download the joint Lynceus/NXP presentation.